We will exhibit at the 10th CAR-ELE JAPAN 2018 which will be held simultaneously with Nepcon Japan 2018.

Date ： Jan. 17 - 19, 2018
Time : 10:00-18:00 (Last day until 17:00)
Venue ： Tokyo Big Sight
Booth ： Harima Chemicals, Inc. Booth
Booth No.：E38-28

Exhibit contents：New products of solder paste for automotive, conductive paste, flux for BGA, and etc.

◇Highly-durable Lead-free solder paste and cored solder
　High joint reliability lead-free solder paste, having excellent joint strength.

◇Lead-free solder paste for 0201 size capacitor and resisitor
　High printability lead-free solder for very small aperature.

◇Silver sinter paste for power semiconductor joining
　High thermal conductive silver paste which is also available for joining of copper and nickel.

◇Copper paste for the electronic parts electrode
　Realizing reduction in cost in a substitute of the silver paste for the electrode.

◇Water Soluble Flux for BGA
　Excellent washability and suppress generation of voids