Harima will exhibit at "NEPCON JAPAN R&D and Manufacturing", held at the largest international exhibition center in Japan, Tokyo Big Sight, Jan 22~24, 2025.
NEPCON JAPAN is Asia's leading exhibition for electronics R&D, manufacturing and packaging technology, and consists of 7 shows specialized in essential areas for electronics manufacturing and R&D. Harima will exhibit at "ELECTRONIC COMPONENTS&MATERIALS EXPO", Japan's primary eponymous event that gathers manufacturers from the electronic, medical, aircraft etc. industries.

■【Exhibition Outline】

・Schedule
January 22~24, 2025: 10:00~17:00

・Location and Access
3-11-1 Ariake, Koto-ku, Tokyo, Japan
https://www.nepconjapan.jp/tokyo/en-gb/visit/access.html

・Entrance Fee and Registration
Free of charge, however requires prior registration
＊Click here to register:
https://www.nepconjapan.jp/tokyo/en-gb/register.html?code=1226047178782024-H2K

■【HARIMA Exhibits】

・Booth Number
E21-39

・Exhibits
At our booth, we will display "Release film for semiconductor molding", "Release agents for
film applications" and "Nanoparticle dispersion technologies", and special presentations of
our exhibits are also scheduled during the event.
For details, please visit our special site here: Harima Exhibits

■Contact
Public Relations, Harima Chemicals Group, Inc.
URL:https://www.harima.co.jp/en/inquiry.php