Harima’s electronic materials business is in charge of the development, manufacture, and sale of items like solder and conductive paste used to mount microchips and form electronic circuits for today’s increasingly compact high-performance electronic devices.
Harima philosophy can be summed up as one that is both Clean (eco-friendly) and Fine (compact and highly functional).
We conduct our daily business activity with this philosophy and bring value-added proposals to the customers. Whether it is the low-cost micro soldering techniques that contribute to miniaturization, or independently developed multifunctional materials capable of shortening the production time of electronic devices, our customers are offered the latest in innovative new products based on advanced technology.
We believe it is our duty to protect the environment, and as such were one of the first to develop lead-free solder paste as a means of preventing the devastating impact that lead has on the environment when it leaches from old or discarded electronics due to acid rain. Ever since our lead-free solder paste was used to produce the world’s very first lead-free MD player in 1998, it has become widely adopted.
Conductive paste is, as the name suggests, an electrically conductive adhesive. Harima’s Extensive knowledge acquired in the fields of coating and adhesion resins has made it possible for us to create conductive paste that, for example, facilitates the release of heat generated by electronic devices (thermal conductivity) to allow for higher density of parts to be mounted. Also characterized by its high reliability and compatibility with various printing methods, conductive paste has become an indispensable soldering material in the parts assembly of next-generation electronics devices such as solar cells and smart phones.
Another of our conductive paste is NanoPaste, a stable distribution of nano-sized* metallic particles in ink-form that only needs to be applied and heated to form a highly reliable metallic membrane for a wide-range of joint and wiring applications. NanoPaste’s applicability to various printing methods, including ink-jet, has made it a prime candidate as a core material in the new area of printed electronics.
Stable distribution is achieved by controlling the dispersion agents.